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Monday, May 11, 2020 | History

3 edition of 1994 IEEE Multi-Chip Module Conference found in the catalog.

1994 IEEE Multi-Chip Module Conference

MCMC-94, March 15-17, 1994, Santa Cruz, California : proceedings

by IEEE Multi-Chip Module Conference (1994 Santa Cruz, Calif.)

  • 14 Want to read
  • 40 Currently reading

Published by IEEE Computer Society Press in Los Alamitos, Calif .
Written in English

    Subjects:
  • Multichip modules (Microelectronics) -- Congresses.

  • Edition Notes

    Other titlesProceedings 1994 IEEE Multi-Chip Module Conference., MCMC "94., IEEE Multi-Chip Module Conference.
    Statementsponsored by IEEE Circuits and Systems Society ... [et al.].
    GenreCongresses.
    ContributionsIEEE Circuits and Systems Society.
    The Physical Object
    Paginationxi, 150 p. :
    Number of Pages150
    ID Numbers
    Open LibraryOL14699024M
    ISBN 100818655623

    CORDIC (for COordinate Rotation DIgital Computer), also known as Volder's algorithm, is a simple and efficient algorithm to calculate hyperbolic and trigonometric functions, typically converging with one digit (or bit) per is therefore also an example of digit-by-digit and closely related methods known as pseudo-multiplication and pseudo-division or factor. On Connectivity Verification in Multi-Chip Module Substrates, UCLA, Computer Science Department Technical Report # CSD, October Member of the Editorial Board of the IEEE Press Book Series. , IEEE International ASIC Conference, Technical Program Committee Member.

    He has co-authored over technical papers in journals, conference proceedings and book chapters, edited 1 book, and holds US patents. He is currently the Chair for the Thermal Technical Working Group for the IEEE Electronics Packaging Society Roadmap effort on Heterogeneous Integration. - electronic only , Orlando , Albuquerque , Portland , Austin , San Jose , Ann Arbor , Paris.

    The metal–oxide–semiconductor field-effect transistor (MOSFET, MOS-FET, or MOS FET), also known as the metal–oxide–silicon transistor (MOS transistor, or MOS), is a type of insulated-gate field-effect transistor (IGFET) that is fabricated by the controlled oxidation of a semiconductor, typically voltage of the covered gate determines the electrical conductivity of the. J. Cong, L. Hagen and A. B. Kahng, “Net Partitions Yield Better Module Partitions”, Proc. 29th ACM/IEEE Design Automation Conf., June , pp. (nominated for Best Paper Award; 18 nominees out of submissions).


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1994 IEEE Multi-Chip Module Conference by IEEE Multi-Chip Module Conference (1994 Santa Cruz, Calif.) Download PDF EPUB FB2

Get this from a library. IEEE Multi-Chip Module Conference: MCMC, March, Santa Cruz, California: proceedings. [IEEE Circuits and Systems Society.;]. Get this from a library. Multi-Chip Module Conference (MCMC). [Institute of Electrical and Electronics Engineers, Inc.

Staff,] -- MCMC is unique in its multi-disciplinary coverage of all aspects of multi-chip modules, with particular emphasis on system applications, technology, design and test, infrastructure, and education. by IEEE Multi-Chip Module Conference ( Santa Cruz, Calif.), IEEE Computer Society., IEEE 4 editions - first published in Not in Library Proceedings of the Eighth Israeli Conference on Computer Systems and Software Engineering.

Crnic, “Electrical Test of Multi-Chip Substrates,” Proc. of International Conference and Exhibition on Multi-chip Modules (ICEMM),pp. – Google ScholarCited by: 6. Fowler, A. El Gamal, and D.

X-D. Yang, "A CMOS Area Image Sensor with Pixel-Level A/D Conversion," IEEE International Solid-State Circuits Conference, San Francisco, CA, pp.FebruaryS.

Lan, A. Ziv, and Abbas El Gamal, "Placement and Routing For a Field Programmable Multi-Chip Module," 31st Design Automation. IEEE Multi-Chip Module Conference, Santa Cruz, CA, pp 58–63, ) 25 years ago, Fig.

Since then, memory chips (especially the NAND Flash) stacking by wire bonding have been in high volume production for, e.g., the smartphones, tablets, and solid state drives as Author: John H. Lau. Adaptor protein 1-dependent clathrin coat assembly on synthetic liposomes and golgi membranes Zhu, Y., Drake, M.

& Kornfeld, S., Jan 1Methods in Enzymology. Optimization Systems Associates (OSA) was founded by John Bandler in OSA produced the first commercial implementation of space mapping optimization to enhance the speed and accuracy of engineering design.

OSA’s primary thrust was in computer-aided design (CAD) and simulation and optimization of radio-frequency and microwave circuits and. The IEEE Multi-Chip Module Conference (MCMC) will be held February 5 - 7, in Santa Cruz, CA.

This multi-disci- plinary conference, co-sponsored by four IEEE Societies (Computer, Circuits and Systems, Electron Devices, and Compo- nents, Packaging and Manufacturing Technology), covers a wide range of top. Professor Wayne W.-M. Dai received the B.A.

degree in Computer Science and Ph.D. degree in Electrical Engineering from the University of California at Berkeley, in andrespectively. He was the founding Chairman of the IEEE Multi-Chip Module Conference, held annually in. You can write a book review and share your experiences. Other readers will always be interested in your opinion of the books you've read.

Whether you've loved the book or not, if you give your honest and detailed thoughts then people will find new books that are. Jarwala N Designing "Dual personality" IEEE compliant multi-chip modules Proceedings of the international conference on Test, () Maly W, Feltham D, Gattiker A, Hobaugh M, Backus K and Thomas M () Smart-Substrate Multichip-Module Systems, IEEE Design & Test,(), Online publication date: 1-Apr Proceedings of IEEE Multi-Chip Module Conference (MCMC), Identification of voltage collapse margins in power systems.

Proceedings of Canadian Conference on Electrical and Computer Engineering, Cited by: The needs of quick turnaround time, high product yield, and low cost have led to the development of another approach, called Symmetric and Programmable Multi-Chip Module (SPMCM) 4 power and.

Precision embedded thin film resistors for multichip modules (MCM-D) Multi-Chip Module Conference, MCMC ', IEEE This book increases understanding of the issues involved in.

• Paul Franzon, Andrew Stanaski, Yusuf Tekmen, Sanjeev Banerjia, “System Design Optimization for MCM'', in Proc. IEEE MultiChip Module Conference. • S. Mehrotra, P. Franzon, G. Bilbro and M. Steer, CAD tools for Managing Signal Integrity and Congestion Simultaneously, Proc.

Topical Meeting on Electrical Performance of. Veluswami A, Nakhla M and Zhang Q Modeling the Frequency-Dependent Parameters of High-Speed Interconnects Proceedings of the Conference on IEEE Multi-Chip Module Conference Ware J and Ciuca I A neural network based integrated image processing environment for object recognition in medical applications Proceedings of the 10th IEEE Symposium.

Proceedings of the IEEE Multi-Chip Module Conference. Country: United States - SIR Ranking of United States: 9. H Index. Subject Area and Category: Engineering Electrical and Electronic Engineering: Publisher: Publication type: Conferences and Proceedings: ISSN:Coverage:.

El Gamal and M. Aref, "The Capacity of the Semi-Deterministic Relay Channel," IEEE Transactions on Information Theory, Vol. IT, No. 3, pp.May A. El Gamal and M. Costa, " The Capacity Region of a Class of Deterministic Interference Channels, " IEEE Transactions on Information Theory, Vol.

IT, No. 2, pp.March Conference Papers "A pJ/Op, TOPS, Scalable Multi-Chip-Module-based Deep Neural Network Accelerator with Ground-Reference Signaling in 16nm.". Refereed Journal Publications and Book Chapters: 1. R. Nair, K. W. Goossen, M. W. Haney, “Dual-prism coupler for board-level free-space optical and Real Estate Utilization in a Free space Multi-chip Global Interconnection Module,” Journal of the Optical Society of America A, Vol.

23, presented at the IEEE AVFOP Conference, September.SIAM Journal on Numerical AnalysisAbstract () Numerical treatment of the parameter identification problem for delay-differential systems arising in immune response modelling. Proceedings IEEE Multi-Chip Module Conference MCMC, Cited by: Chin C.

Lee is an IEEE Fellow and a member of Tau Beta Pi. He is an associate editor of IEEE Trans. Components and Packaging Technologies, and since have served on the Program Committee of the IEEE Electronic Components and Technology Conference (ECTC). Washington DC, May, IEEE Cat.

No. 94 CH C Yi-Chia Chen, Shih.